HTC One M10 possibly leaked in new photo

HTC will not announce their new year flagship during MWC with LG and Samsung, but they are expected to do so in the coming weeks. Way before the official announcement, Evan Blass (@evleaks) managed to snatch a photo of the alleged device and you can see it below.     M10 seems to look a whole lot like the A9, especially in regards to the button style and the layout. Under the screen you can see a fingerprint scanner that may double as a home button (the button itself is rounder than the one on HTC A9, which makes it seem even more similar to an iPhone device). On the front you get a large camera module, but there are no HTC logos on the front of the device in the picture and the Boomsound speakers are also missing.   Blass previously mentioned that HTC M10 will be powered by a Snapdragon 820, 4GB of RAM, and it will have a 5.1-inch 1440×2560 QHD AMOLED screen. We will find out more about the device soon. In the meantime, do you think the device in the picture is indeed HTC’s newest flagship device?   Source: @evleaks via AndroidPolice  

Samsung Unpacked event to take place at Mobile World Congress

Samsung announced today that it will unveil the Galaxy S7 at the Unpacked event held on February 21st at 7PM. The event will take place at the Mobile World Congress in Barcelona. The doors to the event will open one hour earlier. You will also be able to watch the event live on YouTube and Samsung Newsroom.         Samsung released a teaser video to go with the announcement and their lips and images are sealed shut because there is not much to speculate from the vid. All we get is a hashtag, a Gear VR-using person and a floating cube. Rumors put the device packing a Snapdragon 820 processor with a returning microSD slot and possibly USB Type-C support.   https://www.youtube.com/watch?v=3g3O94WALV8     Rumors put the official launch day of the next Samsung flagships on March 11, but we will find out for sure on February 21st. We will keep you posted with details regarding the devices. Stay tuned!   Source: Samsung  

Letv Le Max Pro to have world-first ultrasonic fingerprint biometric sensor

Letv Le Max Pro is the first smartphone to host Snapdragon 820 , which means increased processing speeds, Sense ID, and newer tech altogether.       Sense ID from Snapdragon is a first comprehensive ultrasonic-based fingerprint biometric solution with a liveness detection feature that helps your smartphone be sure that a real finger is being used as authentication. This is the first commercial device to ship with such a feature.   Letv is one of the world’s top innovators, as put by chief operating officer Jun Liang, and Le Max Pro is meant to be the epitome of technology. The smartphone uses the Snapdragon 820 features like an Adreno 530 GPU, a X12 LTE modem, Kyro CPU and Quick Charge 3.0. Sadly, Letv Pro will ship with Quick Charge 2.0 support.   Letv Le Max Pro will not be available in the US, but other devices will surely sport Snapdragon 820 this year.   Source: Droid-Life  

[CES 2016] Qualcomm announces Letv Max Pro as first Snapdragon 820 recipient

Qualcomm announced its most recent SoC will go live in a smartphone as soon as possible and the first recipient is Letv Le Max Pro. The company announced at CES that their Snapdragon 820 processor is used in the Letv smartphone and they even briefly presented the device.       All we know about the device is that it will be powered by an 820 SoC packed with Qualcomm’s ultrasonic fingerprint authentication system found on the back of the phone. The device will also have WiFi 11ad (nicknamed WiGig).   The company also revealed that Snapdragon 820 has already secured 80 design wins, which is pretty impressive for such a powerful and expensive mobile SoC.   On a side-note, Letv Max Pro remains a mystery art this point, because the public will have to wait for its official announcement. Qualcomm CEO Steve Mollenkompf briefly showed a device that seemed functional on stage when he made the announcement, but nothing more is known. It would be interesting to see how much RAM and how big a battery this smartphone gets.  

[The rumor mill] LG G5 to have ticker display, Magic Slot and Snapdragon 820

Samsung Galaxy S7 rumors are abounding right now, but we must not forget other OEMs launching devices next year – LG will soon make announcements regarding LG G5, its G4 follow-up. According to recent reports, the new device will bring some features from G4 and some from LG V10 as well, in the hopes of creating a perfect flagship.   Rumors and ideas   LG G5 is rumored to have a full metal body – an improvement from the usual plastic-based devices it has been rolling out so far. The smartphone is said to have a secondary ticker display to go with the primary 5.3-inch display, kinda like the one you can find on the V10. The second display can be used for quick access to some settings, apps and notifications without having to turn your primary display on.   LG G5 is rumored to run on the latest form of Android on a Snapdragon 820 plus 3GB of RAM. No news on possible expandable storage or on primary storage options yet.   The most curious mention is that of a Magic Slot – feature which allows the device to add more hardware modules. This could be useful with a detachable keyboard, a VR headset or other accessories.   We are close to a new LG launch and a new LG flagship. Would you like a G5 dressed in metal? Let us know in the comments below!   Source: Droid Life  

Snapdragon 820 revealed – meet next year’s flagship processor

Today, Qualcomm revealed its most recent system on chip that will probably power some of next year’s flagships, Snapdragon 820. With it, Qualcomm announced its desire to create a technology “designed around enriching visual quality and audio clarity.” This basically means that the new chip has a much improved GPU and better image processing, plus better audio. The improvements should help a smartphone with with faster upload/download speeds, much improved performance and faster quick charging.       The most important new features for Snapdragon 820:   Kyro CPU and Hexagon 680 DSP: up to 2.2 GHz 64-bit quad-core CPU that provides twice the performance of a Snapdragon 810 CPU, improvements in battery life and ultra-low power advanced imaging Adreno 530 GPU: 40% overall improvements over Adreno 430 GPU (better graphic performance, better computer capabilities and efficacious power usage X12 LTE Modem: 3x faster peak upload speeds and 33% faster peak download speeds when compared to X10 LTE modem from previous SoCs. (LTE 12 provides 600 Mbps download speeds) Quick Charge 3.0: 38% more efficient than Quick Charge 2.0 (four times faster than usual charging) Advanced WiFi: supports 802.11ad and 802.11ac 2×2-MU-MINO WiFi (at least twice faster than 802.11ac WiFi) Spectra camera ISP: supports capture of up to 28MP, hybrid autofocus, 14-bit image sensors and multi-sensor fusion algorithms.   Snapdragon 820 will not be available for smartphones immediately though, as we can only expect the hardware to power phones starting next year.   Source: Qualcomm